Built-off test device and test system including the same

ABSTRACT

A built-off test (BOT) device includes a signal processing block, an output selection block and a signal control block. The signal processing block duplicates a test signal to apply a plurality of duplicated test signals to each of a plurality of devices under test (DUTs) through each of corresponding channels, and the signal processing block provides a plurality of decision signals based upon a plurality of test result signals received from each of the DUTs. The output selection block merges the decision signals as a final decision signal or sequentially outputs the decision signals as the final decision signal, in response to an output mode selection signal. The signal control block provides the test signal to the signal processing block or provides the final decision signal externally, in response to a first switching control signal.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Divisional Application of U.S. patent applicationSer. No. 12/900,748 filed on Oct. 8, 2010, which claims under 35 USC§119 priority to and the benefit of Korean Patent Application No.10-2009-0109438, filed on Nov. 13, 2009 in the Korean IntellectualProperty Office (KIPO), the entire content of each of which isincorporated by reference herein.

BACKGROUND

1. Technical Field

The present disclosure relates to semiconductor devices, and, moreparticularly, to a test device of semiconductor memory devices.

2. Discussion of the Related Art

Automatic test equipment (ATE) is used for testing semiconductordevices, and ATEs are required to have performance suitable for testingthe semiconductor devices. As the performance expectations of thesemiconductor devices become more and more enhanced and the operatingspeed of the semiconductor devices becomes faster and faster, abuilt-off test (BOT), where the test functionality is brought to theclosest possible proximity of the device-under-test (DUT), e.g., to aload board, has been employed. However, the conventional BOT can havevarious problems, such as extended test times, particularly when thenumber of DUTs being tested increases.

SUMMARY

Exemplary embodiments provide both a BOT device capable of increasingtest coverage without increasing test time and a test system thatincludes the BOT device.

According to an exemplary embodiment, a BOT device includes a signalprocessing block configured to duplicate a test signal, to apply aplurality of duplicated test signals to each of a plurality of DUTsthrough each of corresponding channels, and to provide a plurality ofdecision signals based upon a plurality of test result signals beingreceived from each of the DUTs. An output selection block is configuredto merge the decision signals as a final decision signal or tosequentially output the decision signals as the final decision signal,in response to an output mode selection signal. A signal control blockis configured to provide the test signal to the signal processing blockor to provide the final decision signal externally, in response to afirst switching control signal.

The signal processing block may include a plurality of signal processingunits, each of the signal processing units having a buffer thatduplicates the test signal to provide the duplicated test signal, arelay that provides the duplicated test signal to the corresponding DUTwhen a second switching control signal is at a first logic level, acomparison circuit that compares the corresponding test result signalwith a reference level to provide the corresponding decision signal whenthe second switching control signal is at a first logic level, and aregister that stores and outputs the decision signal.

The buffer may be provided with first and second power supply voltages,and a voltage level of the duplicated test signal may be adjustableaccording to the first and second power supply voltages.

The decision signal stored in the register may be provided to the outputselection block when a test of all the DUTs is completed.

The comparison circuit may be provided with third and fourth powersupply voltages, and a voltage level of the decision signal may beadjustable according to the third and fourth supply voltages.

The comparison circuit may provide a decision signal that indicates afailed test when the test result signal is the same as the referencelevel.

The comparison circuit may provide a decision signal that indicates afailed test when the test result signal is different from the referencelevel.

The output selection block may merge the test result signals as thefinal decision signal when the output mode selection signal is at afirst logic level, and may sequentially output the test result signalsas the final decision signal when the output mode selection signal is ata second logic level.

The output selection block may include a merging circuit configured toreceive and merge the plurality of decision signals, a multiplexerconfigured to select and sequentially output one of the plurality ofdecision signals in response to a selection signal, a counter thatgenerates the selection signal, and a relay connected to an output ofthe merging circuit when the output mode selection signal is at thefirst logic level, and connected to an output of the multiplexer whenthe output mode selection signal is at the second logic level.

The merging circuit may include an OR gate that outputs the finaldecision signal of a first logic level that indicates a failed test whenat least one of test signals is at the first logic level.

The merging circuit may include an AND gate that outputs the finaldecision signal of a second logic level that indicates a failed testwhen at least one of test signals is at the second logic level.

The output selection block may include a merging circuit configured tobe selectively enabled in response to the output mode selection signaland to receive and merge the plurality of decision signals, amultiplexer configured to be selectively enabled in response to theoutput mode selection signal and to select and sequentially output oneof the plurality of decision signals in response to a selection signal,and a counter which is selectively enabled in response to the outputmode selection signal and generates the selection signal.

The merging circuit may be enabled when the output mode selection signalis at the first logic level, and the multiplexer and the counter may beenabled when the output mode selection signal is at the second logiclevel.

According to an exemplary embodiment, a test system includes a testdevice configured to generate a plurality of test signals thatcorrespond to each of a plurality of test parameters, a BOT moduleconfigured to duplicate the test signals, to apply a plurality ofduplicated test signals to each of a plurality of DUTs through each ofcorresponding channels, and to provide a plurality of decision signalsbased upon a plurality of final test result signals received from eachof the DUTs, and a test board connected to the BOT module through thechannels, the DUTs being mounted on the test board.

The test device may include a plurality of signal generating circuitsconfigured to generate the test signals and to receive the final testresult signals. Each of the signal generating circuits may include atest pattern generator configured to generator a test pattern, a bufferwhich buffers the test pattern to output the test signal, a first relaythat provides the test signal to the BOT module when a first switchingcontrol signal is at a first logic level, and a comparison circuit thatcompares the corresponding final test result signal with a referencelevel to provide a final result signal when the first switching controlsignal is at a second logic level.

The BOT module may include a plurality of BOT units, each of the BOTunits including a signal processing block configured to duplicatecorresponding ones of the test signals, to apply a plurality ofduplicated test signals to each of DUTs, and to provide a plurality ofdecision signals based upon a plurality of test result signals from thecorresponding DUT, an output selection block configured to merge or tosequentially output corresponding decision signals as a correspondingfinal decision signal, in response to an output mode selection signal,and a signal control block configured to provide the corresponding testsignal to the signal processing block or to provide the final decisionsignal to the test device, in response to a second switching controlsignal.

The plurality of test signals may be simultaneously determined as passor fail.

The BOT module may be mounted on the test board.

The BOT module may be mounted on the test device.

According to an exemplary embodiment, an apparatus for testing multiplesemiconductor devices includes a signal processor coupled throughrespective channels to a plurality of semiconductor devices. A signalcontroller is configured to, in response to a switching control signal,selectively supply to the signal processor a common test signal forprocessing by each of the plurality of semiconductor devices, orexternally provide a final decision signal based upon the common testsignal having been processed by the semiconductor devices. An outputselector is configured to, in response to an output mode selectionsignal, provide the final decision signal to the signal controller. Thefinal decision signal is either a one by one sequence of test resultdecision signals or a merger of the test result decision signals toindicate a failed test of at least one of the semiconductor devices.Each test result decision signal is based upon a comparison between areference level and a test result signal from a respective semiconductordevice having processed the common test signal.

Accordingly, the BOT device according to exemplary embodiments mayreduce test time when a number of DUTs increases by duplicating limitedtest signals to provide the duplicated test signals to DUTs,simultaneously determining the test result signals from the DUTs andproviding the final decision signal to the test device after the test iscompleted.

BRIEF DESCRIPTION OF THE DRAWINGS

Illustrative, non-limiting exemplary embodiments will be more clearlyunderstood from the following detailed description taken in conjunctionwith the accompanying drawings.

FIG. 1 is a block diagram illustrating a 130T device according to anexemplary embodiment.

FIG. 2 is a block diagram illustrating an exemplary embodiment of thesignal processing block of FIG. 1.

FIGS. 3A and 3B illustrate exemplary embodiments of the comparisoncircuit in FIG. 2.

FIGS. 4A and 4B are tables illustrating the decision signal of FIGS. 3Aand 3B based upon the test result signal and the reference levelrespectively.

FIG. 5 is a circuit diagram illustrating an exemplary embodiment of theoutput selection block in FIG. 2.

FIGS. 6A and 6B illustrate exemplary embodiments of the merging circuitin FIG. 5.

FIGS. 7A, 7B, 7C and 7D are timing diagrams illustrating operation ofthe BOT device of FIG. 1.

FIG. 8 is a block diagram illustrating a test system according to anexemplary embodiment.

FIG. 9 is a block diagram illustrating an exemplary embodiment of thetest device in FIG. 8.

FIG. 10 is a block diagram illustrating an exemplary embodiment of BOTmodule in FIG. 8.

FIG. 11 is a block diagram illustrating an exemplary embodiment of thesignal processing block in BOT unit in FIG. 9.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Various exemplary embodiments will be described more fully hereinafterwith reference to the accompanying drawings, in which exemplaryembodiments are shown.

The present inventive concept may, however, be embodied in manydifferent forms and should not be construed as limited to the exemplaryembodiments set forth herein. In the drawings, the sizes and relativesizes of areas or regions may be exaggerated for clarity. Like numeralsrefer to like elements throughout.

It will be understood that, although the terms first, second, third etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are used to distinguish oneelement from another. Thus, a first element discussed below could betermed a second element without departing from the teachings of thepresent inventive concept. As used herein, the term “and/or” includesany and all combinations of one or more of the associated listed items.

It will be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent.

FIG. 1 is a block diagram illustrating a BOT device according to anexemplary embodiment.

In FIG. 1, a plurality of DUTs 31, 32, 33, 34 are illustrated togetherfor convenience of explanation.

Referring to FIG. 1, a BOT device 10 includes a signal processing block100, an output selection block 200 and a signal control block 20.

The signal control block 20 includes a relay 21, and the relay 21 isselectively connected to one of the signal processing block 100 and theoutput selection block 200 in response to a logic level of a firstswitching control signal SCS1. In an exemplary embodiment, when thefirst switching control signal SCS1 is at a first logic level (logichigh level), the relay 21 is connected to the signal processing block100, and the signal control block 20 may provide a test signal TS froman external tester (not illustrated) to the signal control block 20 insome embodiments. In an exemplary embodiment, when the first switchingcontrol signal SCS1 is at second logic level (logic low level), therelay 21 is connected to the output selection block 200, and the signalcontrol block 20 may provide a final decision signal FDS to the externaltester. In other exemplary embodiments, the relay 21 may be connected tothe signal processing block 100 when the first switching control signalSCS1 is at the second logic level, and the relay 21 may be connected tothe output selection block 200, when the first switching control signalSCS1 is at the first logic level.

The signal processing block 100 receives the test signal TS, andduplicates the test signal TS to provide each of a plurality ofduplicated test signals DTS to each of the DUTs 31, 32, 33, 34 througheach of a plurality of channels CH1, CH2, CH3, CH4. In addition, thesignal processing block 100 receives each of test result signals TRS1,TRS2, TRS3, TRS4 from each of the DUTs 31, 32, 33, 34, and provides aplurality of decision signals DS1, DS2, DS3, DS4 to the output selectionblock 200 based upon the received test result signals TRS1, TRS2, TRS3,TRS4. Architectural and operational details of the signal processingblock 100 will be described below with reference to FIG. 2.

The output selection block 200 merges the decision signals DS1, DS2,DS3, DS4 to provide a final decision signal FDS or the output selectionblock 200 sequentially provides the decision signals DS1, DS2, DS3, DS4as the final decision signal FDS, in response to an output modeselection signal OMSS. Architectural and operational details of theoutput selection block 200 will be described below with reference toFIG. 4.

FIG. 2 is a block diagram illustrating an exemplary embodiment of thesignal processing block of FIG. 1 according to an exemplary embodiment.In FIG. 2, the plurality of DUTs 31, 32, 33, 34 are illustrated togetherfor convenience of explanation.

Referring to FIG. 2, a signal processing block 100 includes a pluralityof signal processing units 110, 120, 130, 140. Each of the signalprocessing units 110, 120, 130, 140 is connected to a respective one ofthe DUTs 31, 32, 33, 34 through a respective one of the channels CH1,CH2, CH3, CH4. In FIG. 2, the signal processing unit 110 is illustratedin detail, and each of the other signal processing units 120, 130, 140may have substantially the same structure as the signal processing unit110. In addition, although the signal processing block 100 includes foursignal processing units 110, 120, 130, 140, the signal processing block100 may include more or less than four signal processing units.Therefore, the test signal TS may be duplicated without limitation as toparticular amounts of branches.

The signal processing unit 110 includes a buffer 111, a relay 112, acomparison circuit 113 and a register 114.

The buffer 111 buffers (or duplicates) the test signal TS to output aduplicated test signal DTS. The buffer 111 is provided with first andsecond power supply voltages VIH, VIL, and a level of the first powersupply voltage VIH is higher than a level of the second power supplyvoltage VIL. Levels of the first and second power supply voltages VIH,VIL may be adjusted externally, and thus the duplicated test signal DTSmay be adjusted to have a voltage level ranging between the first andsecond power supply voltages VIH, VIL. When the voltage level of thetest signal TS does not have sufficient level margin, the duplicatedtest signal DTS may be adjusted to provide sufficient level margin byadjusting the levels of the first and second power supply voltages VIH,VIL. The relay 112 provides the duplicated test signal DTS to the DUT 31when a second switching control signal SCS2 is at a first logic level(for example, a logic high level).

The comparison circuit 113 is connected to the DUT 31 through thechannel CH1 at a tap TAP1. The comparison circuit 113 compares the testresult signal TRS1 from the DUT 31 with a reference level to provide thedecision signal DS1 indicating the comparison result to the register 114when the second switching control signal SCS2 is in a second logic level(for example, logic low level). The comparison circuit 113 is providedwith third and fourth power supply voltages VOH, VOL, and a level of thethird power supply voltage VOH is higher than a level of the fourthpower supply voltage VOL. Levels of the third and fourth power supplyvoltages VOH, VOL may be adjusted externally, and thus the decisionsignal DS1 may be adjusted to have a voltage level ranging between thethird and fourth power supply voltages VOH, VOL. When the voltage levelof the decision signal DS1 does not have sufficient level margin, thedecision signal DS1 may be adjusted to provide sufficient level marginby adjusting levels of the third and fourth power supply voltages VOH,VOL.

The register 114 stores the decision signal DS1, and the register 114outputs the stored decision signal DS1 to the output selection block 200in response to a register control signal RCS.

With reference to FIG. 2, the architecture and operation of the signalprocessing unit 110 have been described, and the architecture andoperation of the other signal processing units 120, 130, 140 would besubstantially the same as the architecture and the operation of thesignal processing unit 110. Therefore, detailed description of thearchitectures and the operations of other signal processing units 120,130, 140 is omitted. The signal processing unit 120 receives the testresult signal TRS2 to provide the decision signal DS2 to the outputselection block 200. The signal processing unit 130 receives the testresult signal TRS3 to provide the decision signal DS3 to the outputselection block 200. The signal processing unit 140 receives the testresult signal TRS4 to provide the decision signal DS4 to the outputselection block 200. That is, the signal processing units 110, 120, 130,140 in the signal processing block 100 simultaneously make pass/faildecisions based upon the test result signals TRS1, TRS2, TRS3, TRS4 fromthe DUTs 31, 32, 33, 34.

FIGS. 3A and 3B illustrate exemplary embodiments of the comparisoncircuit 113 of FIG. 2.

In FIG. 3A, a comparison circuit 113 a is implemented with arepresentative exclusive OR gate 115. The exclusive OR gate 115 outputsthe decision signal DS1 having a logic low level when the test resultsignal TRS1 has a same level as the reference level REF, and theexclusive OR gate 115 outputs the decision signal DS1 having a logichigh level when the test result signal TRS1 does not have a same levelas the reference level REF. Therefore, when the decision signal DS1 hasa logic high level, the decision signal DS1 indicates a failed test, andwhen the decision signal DS1 has a logic low level, the decision signalDS1 indicates a test pass. The reference level REF may be set to have asame level as the test signal TS.

In FIG. 3B, a comparison circuit 113 b is implemented with an exclusiveNOR gate 116. The exclusive NOR gate 116 outputs the decision signal DShaving a logic high level when the test result signal TRS1 has adifferent level from the reference level REF, and the exclusive NOR gate116 outputs the decision signal DS having a logic low level when thetest result signal TRS1 has a same level as the reference level REF.Therefore, when the decision signal DS1 has a logic low level, thedecision signal DS1 indicates a failed test, and when the decisionsignal DS1 has a logic high level, the decision signal DS1 indicates atest pass. The reference level REF may be similarly set to have a samelevel as the test signal TS.

FIGS. 4A and 4B are tables illustrating the decision signal DS of FIGS.3A and 3B based upon the test result signal and the reference levelrespectively.

Referring to FIGS. 4A and 4B, it is noted that the levels of thedecision signal DS indicating the failed test are different from eachother for the respective gates of FIGS. 3A and 3B.

FIG. 5 is a circuit diagram illustrating an exemplary embodiment of theoutput selection block 200 of FIG. 1.

Referring to FIG. 5, the output selection block 200 includes a mergingcircuit 210, a multiplexer 220, a counter 230 and a relay 240. Themerging circuit 210 merges decision signals DS1, DS2, DS3, DS4 toprovide a merged final decision signal FDSM. The multiplexer 220 selectsthe decision signals DS1, DS2, DS3, DS4 one by one to output asequential final decision signal FDSS in response to a selection signalSS from the counter 230. The counter 230 may increase or decrease theselection signal SS one by one. When the counter 230 increases theselection signal SS one by one, the decision signals DS1, DS2, DS3, DS4may be output in an increasing order. When the counter 230 decreases theselection signal SS one by one, the decision signals DS1, DS2, DS3, DS4may be output in a decreasing order. When the decision signal DS1 of thedecision signals DS1, DS2, DS3, DS4 is selected and the counter 230increases the selection signal SS one by one, the decision signals DS1,DS2, DS3, DS4 may be output in an order from the decision signal DS1 tothe decision signal DS4. When the decision signal DS1 of the decisionsignals DS1, DS2, DS3, DS4 is selected and the counter 230 decreases theselection signal SS one by one, the decision signals DS1, DS2, DS3, DS4may be output in an order from the decision signal DS1 through decisionsignals DS4, DS3 to the decision signal DS2.

The relay 240 is connected to an output of the merging circuit 210 or anoutput of the multiplexer 220 in response to an output mode selectionsignal OMSS. For example, when the output mode selection signal OMSS isat a first logic level (for example, logic high level), the relay 240 isconnected to the output of the merging circuit 210, and thus, the mergedfinal decision signal FDSM is output as a final decision signal FDS. Forexample, when the output mode selection signal OMSS is at a second logiclevel (for example, a logic low level), the relay 240 is connected tothe output of the multiplexer 220, and thus, the sequential finaldecision signal FDSS is output as the final decision signal FDS. Inother embodiments, the first logic level may be a logic low level, andthe second logic level may be a logic high level.

In an exemplary embodiment the output mode selection signal OMSS may beapplied to the merging circuit 210, the multiplexer 220 and the counter230. When the output mode selection signal OMSS is at a first logiclevel, the merging circuit 210 may be enabled, and the multiplexer 220and the counter 230 may be disabled. Therefore, when the output modeselection signal OMSS is at the first logic level, the merged finaldecision signal FDSM is output as the final decision signal FDS. Whenthe output mode selection signal OMSS is at a second logic level, themerging circuit 210 may be disabled, and the multiplexer 220 and thecounter 230 may be enabled. Therefore, when the output mode selectionsignal OMSS is at the second logic level, the sequential final decisionsignal FDSS is output as the final decision signal FDS. Accordingly,when the output mode selection signal OMSS is applied to the mergingcircuit 210, the merged final decision signal FDSM or the sequentialfinal decision signal FDSS may be provided to the relay 21 in FIG. 1 asthe final decision signal FDS in response to the output mode selectionsignal OMSS without including the relay 240.

The merging circuit 210 may be implemented with various logic gates andFIGS. 6A and 6B illustrate exemplary embodiments of the merging circuitin FIG. 5.

Referring to FIG. 6A, the merging circuit 210 may include an OR gate211. The OR gate 211 along with the exclusive OR gate 115 of FIG. 3A maybe included in the BOT device 10 of FIG. 1. The OR gate 211 outputs themerged final decision signal FDSM having a logic high level indicatingthe failed test, when at least one of the decision signals DS1, DS2,DS3, DS4 indicates the failed test (logic high level).

Referring to FIG. 6B, the merging circuit 210 may include an AND gate212. The AND gate 212 with the exclusive NOR gate 116 of FIG. 3B may beincluded in the BOT device 10 of FIG. 1. The AND gate 212 outputs themerged final decision signal FDSM having a logic low level indicatingthe failed test, when at least one of the decision signals DS1, DS2,DS3, DS4 indicates the failed test (logic low level).

FIGS. 7A through 7D are timing diagrams illustrating the operation ofthe BOT device 10 of FIG. 1.

In FIGS. 7A through 7D, although the test signal TS is illustrated assingle pulse signal for convenience, the test signal TS may be varioustest pattern signals including a series of pulse signals. In addition,for FIGS. 7A and 7B, the comparison circuit 113 is implemented with theexclusive OR gate 115 of FIG. 3A and the merging circuit 210 isimplemented with the OR gate 211 of FIG. 6A.

Referring to FIG. 7A, when the first switching control signal SCS1 andthe second switching control signal SCS2 transition to a logic highlevel at time T1, the relay 21 is connected to the signal processingblock 100 and the relay 112 is connected to the DUT 31.

At time T2, the test signal TS is applied to the buffer 111 and the testsignal TS is duplicated. At time T3, the duplicated test signal DTS1 isapplied to the DUT 31. The first switching control signal SCS1 ismaintained at a logic high level during a time period long enough forthe test signal TS to be applied to the buffer 111, and the secondswitching control signal SCS2 is maintained at a logic high level duringa time period long enough for the duplicated test signal DTS to beapplied to the DUT 31.

At time T4, each of the test result signals TRS1, TRS2, TRS3, TRS4 isapplied to the respective ones of the signal processing units 110, 120,130, 140. Each of the test result signals TRS1, TRS2, TRS3, TRS4 has alogic high level. At time T5, the output mode selection signal OMSS1transitions to a logic high level, and the relay 240 is connected to theoutput of the merging circuit 240. At time T6, the decision signals DS1,DS2, DS3, DS4 are applied to the output selection block 200. Each of thedecision signals DS1, DS2, DS3, DS4 has a logic low level indicatingthat test passes. Therefore, at time T7, the merged final decisionsignal FDS1 having a logic low level is provided at the relay 240 as thefinal decision signal FDS. When the output mode selection signal OMSS2transitions to a logic low level at the time T5, the relay 240 isconnected to the multiplexer 220. Therefore, at the time T7, thedecision signals DS1, DS2, DS3, DS4 are sequentially output one by one,and thus, the sequential final decision signal FDS2 is provided at therelay 240 as the final decision signal FDS.

Referring to FIG. 7B, at the time T4, the test result signal TRS2 has alogic low level indicating a failed test, and thus, the decision signalDS2 has a logic high level at the time T6. Therefore, the merged finaldecision signal FDS1 having a logic high level indicating the failedtest is provided at the relay 240 at the time T7. When the output modeselection signal OMSS1 transitions to a logic low level at the time T5,the relay 240 is connected to the multiplexer 220. Therefore, at thetime T7, the decision signals DS1, DS2, DS3, DS4 are sequentially outputone by one, and thus, the sequential final decision signal FDS2 isprovided at the relay 240.

In FIGS. 7C and 7D, it is assumed that the comparison circuit 113 isimplemented with the exclusive NOR gate 116 of FIG. 3B and the mergingcircuit 210 is implemented with the AND gate 212 of FIG. 6B.

Referring to FIG. 7C, each of the test result signals TRS1, TRS2, TRS3,TRS4 transitions to a logic high level. At the time T5, the output modeselection signal OMSS1 transitions to a logic high level, and the relay240 is connected to the output of the merging circuit 240. At the timeT6, the decision signals DS1, DS2, DS3, DS4 are applied to the outputselection block 200. Each of the decision signals DS1, DS2, DS3, DS4 hasa logic high level indicating that test passes. Therefore, at the timeT7, the merged final decision signal FDS1 having a logic high level isprovided at the relay 240 as the final decision signal FDS. When theoutput mode selection signal OMSS2 transitions to a logic low level atthe time T5, the relay 240 is connected to the multiplexer 220.Therefore, at the time T7, the decision signals DS1, DS2, DS3, DS4 aresequentially output one by one, and thus, the sequential final decisionsignal FDS2 is provided at the relay 240 as the final decision signalFDS.

Referring to FIG. 7D, at the time T4, the test result signal TRS2 has alogic low level indicating a failed test, and thus, the decision signalDS2 has a logic low level at the time T6. Therefore, the merged finaldecision signal FDS1 having a logic low level indicating the failed testis provided at the relay 240 at the time T7. When the output modeselection signal OMSS1 transitions to a logic low level at the time T5,the relay 240 is connected to the multiplexer 220. Therefore, at thetime T7, the decision signals DS1, DS2, DS3, DS4 are sequentially outputone by one, and thus, the sequential final decision signal FDS2 isprovided at the relay 240.

FIG. 8 is a block diagram illustrating a test system according to anexemplary embodiment.

Referring to FIG. 8, a test system 300 includes a test device 400 suchas an automatic test equipment (ATE), a BOT module 450 and a test board460. A plurality of DUTs 461, 462, 463, 464 are mounted on the testboard 460. Each of the DUTs 461, 462, 463, 464 may be a memory device,but are not limited to memory devices.

The test device 400 provides a plurality of test signals TS1, . . . TS4to the BOT module 450 and each of the test signals TS1, . . . TS4 may beassociated with each of a plurality of test parameters. The test signalTS1 may be associated with data DQ, the test signal TS2 may beassociated with a data strobe signal DQs, the test signal TS3 may beassociated with command/address, and the test signal TS4 may beassociated with a clock signal CK. Architectural and operational detailsof the test device will be described below with reference to FIG. 9.

The BOT module 450 duplicates each of the test signals TS1, . . . TS4 toprovide duplicated test signals DTS1˜DTS4 to each of the respective DUTs461, 462, 463, 464 through respective ones of a plurality of channelsCH1, CH2, CH3, CH4. In addition, the BOT module 450 receives a pluralityof test result signals TRS11˜TRS14, TRS21˜TRS24, TRS31˜TRS34 andTRS41˜TRS44 from the DUTs 461, 462, 463, 464 through the channels CH1,CH2, CH3, CH4, and provides a plurality of final decision signals FDS1,. . . FDS4 to the test device 400 based upon the test result signalsTRS11˜TRS14, TRS21˜TRS24, TRS31˜TRS34 and TRS41˜TRS44. In addition, theBOT module 450 includes a plurality of BOT units 500, 600, 700, 800.Architectural and operational details of the BOT module 450 and the BOTunits 500, 600, 700, 800 will be described below with reference to FIG.10.

FIG. 9 is a block diagram illustrating an exemplary embodiment of thetest device 400 of FIG. 8.

Referring to FIG. 9, the test device 400 includes a plurality of signalgenerating circuits 410, 420, 430, 440.

The signal generating circuit 410 includes a test pattern generator 411,a buffer 412, a relay 413 and a comparison circuit 414. The test patterngenerator 411 generates a test pattern signal TPS1. The test patternsignal TPS1 may be associated with the data DQ. The buffer 412 buffersthe test pattern signal TPS1 to provide the test signal TS1. The relay413 provides the test signal TS1 to the BOT module 450 when a firstswitching control signal SCS1 is at a first logic level (for example,logic high level). The comparison circuit 414 compares the finaldecision signal FDS1 with a reference level REFT1 to provide a finalresult signal FRS1 when the first switching control signal SCS1 is at asecond logic level (for example, logic low level). The final decisionsignal FDS1 may be associated with the data DQ.

The signal generating circuit 420 includes a test pattern generator 421,a buffer 442, a relay 423 and a comparison circuit 424. The test patterngenerator 421 generates a test pattern signal TPS2. The test patternsignal TPS2 may be associated with the data strobe DQs. The buffer 422buffers the test pattern signal TPS2 to provide the test signal TS2. Therelay 423 provides the test signal TS2 to the BOT module 450 when thefirst switching control signal SCS1 is at a first logic level (forexample, logic high level). The comparison circuit 424 compares thefinal decision signal FDS2 with a reference level REFT2 to provide afinal result signal FRS2 when the first switching control signal SCS2 isat a second logic level (for example, logic low level). The finaldecision signal FDS2 may be associated with the data strobe DQs.

The signal generating circuit 430 includes a test pattern generator 431,a buffer 432, a relay 433 and a comparison circuit 434. The test patterngenerator 431 generates a test pattern signal TPS3. The test patternsignal TPS3 may be associated with the command/address. The buffer 432buffers the test pattern signal TPS3 to provide the test signal TS3. Therelay 433 provides the test signal TS3 to the BOT module 450 when thefirst switching control signal SCS1 is at a first logic level (forexample, logic high level). The comparison circuit 434 compares thefinal decision signal FDS3 with a reference level REFT3 to provide afinal result signal FRS3 when the first switching control signal SCS1 isat a second logic level (for example, logic low level). The finaldecision signal FDS3 may be associated with the command/address.

The signal generating circuit 440 includes a test pattern generator 441,a buffer 442, a relay 443 and a comparison circuit 444. The test patterngenerator 441 generates a test pattern signal TPS4. The test patternsignal TPS4 may be associated with the clock signal CK. The buffer 442buffers the test pattern signal TPS4 to provide the test signal TS4. Therelay 443 provides the test signal TS4 to the BOT module 450 when thefirst switching control signal SCS1 is at a first logic level (forexample, logic high level). The comparison circuit 444 compares thefinal decision signal FDS4 with a reference level REFT3 to provide afinal result signal FRS4 when the first switching control signal SCS1 isat a second logic level (for example, logic low level). The finaldecision signal FDS4 may be associated with the clock signal CK.

FIG. 10 is a block diagram illustrating an exemplary embodiment of theBOT module 450 of FIG. 8 according to an exemplary embodiment.

Referring to FIG. 10, the BOT module 450 includes a plurality of BOTunits 500, 600, 700, 800.

The BOT unit 500 includes a signal control block 510 having a relay 511,a signal processing block 520 and an output selection block 530. Thesignal processing block 520 duplicates the test signal TS1 to providethe duplicated test signal DTS1 to each of the DUTs 461, 462, 463, 464.In addition, the signal processing block 520 receives the test resultsignals TRS11, TRS12, TRS13 TRS14 from the DUT 461 and provides aplurality of decision signals DS11, DS12, DS13, DS14 based upon the testresult signals TRS11, TRS12, TRS13, TRS14. The output selection block530 merges the decision signals DS11, DS21, DS31, DS41 of the decisionsignals DS11, DS12, DS13, DS14, DS21, DS22, DS23, DS24, DS31, DS32,DS33, DS34, DS41, DS42, DS43, DS44 to provide the final decision signalFDS1 or sequentially outputs the decision signals DS11, DS21, DS31, DS41one by one as the final decision signal FDS1. The decision signals DS11,DS21, DS31, DS41 may be associated with one of the test parameters (forexample, the data DQ). The signal control block 510 connects the testsignal TS1 to the signal processing block 520 or connects the finaldecision signal FDS1 to the comparison circuit 414 in FIG. 9, inresponse to a second switching control signal SCS2. When the secondswitching control signal SCS2 is at a first logic level (for example,logic high level), the test signal TS1 is provided to the signalprocessing block 520. When the second switching control signal SCS2 isat a second logic level (for example, logic low level), the finaldecision signal FDS1 is provided to the comparison circuit 414 in FIG.9.

The BOT unit 600 includes a signal control block 610 having a relay 611,a signal processing block 620 and an output selection block 630. Thesignal processing block 620 duplicates the test signal TS2 to providethe duplicated test signal DTS2 to each of the DUTs 461, 462, 463, 464.In addition, the signal processing block 620 receives the test resultsignals TRS21, TRS22, TRS23, TRS24 from the DUT 462 and provides aplurality of decision signals DS21, DS22, DS23, DS24 based upon the testresult signals TRS21, TRS22, TRS23, TRS24. The output selection block630 merges the decision signals DS12, DS22, DS32, DS42 of the decisionsignals DS11, DS12, DS13, DS14, DS21, DS22, DS23, DS24, DS31, DS32,DS33, DS34, DS41, DE42, DS43, DS44 to provide the final decision signalFDS2 or sequentially outputs the decision signals DS12, DS22, DS32, DS42one by one as the final decision signal FDS2. The decision signals DS12,DS22, DS32, DS42 may be associated with one of the test parameters (forexample, the data strobe DQs). The signal control block 610 connects thetest signal TS2 to the signal processing block 620 or connects the finaldecision signal FDS2 to the comparison circuit 424 in FIG. 9, inresponse to the second switching control signal SCS2. When the secondswitching control signal SCS2 is at a first logic level (for example,logic high level), the test signal TS2 is provided to the signalprocessing block 620. When the second switching control signal SCS2 isat a second logic level (for example, logic low level), the finaldecision signal FDS2 is provided to the comparison circuit 424 in FIG.9.

The BOT unit 700 includes a signal control block 710 having a relay 711,a signal processing block 720 and an output selection block 730. Thesignal processing block 720 duplicates the test signal TS3 to providethe duplicated test signal DTS3 to each of the DUTs 461, 462, 463, 464.In addition, the signal processing block 720 receives the test resultsignals TRS31, TRS32, TRS33, TRS34 from the DUT 463 and provides aplurality of decision signals DS31, DS32, DS33, DS34 based upon the testresult signals TRS31, TRS32, TRS33, TRS34. The output selection block730 merges the decision signals DS13, DS23, DS33, DS43 of the decisionsignals DS11, DS12, DS13, DS14, DS21, DS22, DS23, DS24, DS31, DS32,DS33, DS34, DS41, DS42, DS43, DS44 to provide the final decision signalFDS3 or sequentially outputs the decision signals DS13, DS23, DS33, DS43one by one as the final decision signal FDS3. The decision signals DS13,DS23, DS33, DS43 may be associated with one of the test parameters (forexample, the command/address). The signal control block 710 connects thetest signal TS3 to the signal processing block 720 or connects the finaldecision signal FDS3 to the comparison circuit 434 in FIG. 9, inresponse to the second switching control signal SCS2. When the secondswitching control signal SCS2 is at a first logic level (for example,logic high level), the test signal TS3 is provided to the signalprocessing block 720. When the second switching control signal SCS2 isat a second logic level (for example, logic low level), the finaldecision signal FDS3 is provided to the comparison circuit 434 in FIG.9.

The BOT unit 800 includes a signal control block 810 having a relay 811,a signal processing block 820 and an output selection block 830. Thesignal processing block 820 duplicates the test signal TS4 to providethe duplicated test signal DTS4 to each of the DUTs 461, 462, 463, 464.In addition, the signal processing block 820 receives the test resultsignals TRS41, TRS42, TRS43, TRS44 from the DUT 464 and provides aplurality of decision signals DS41, DS42, DS43, DS44 based upon the testresult signals TRS41, TRS42, TRS43, TRS44. The output selection block830 merges the decision signals DS14, DS24, DS34, DS44 of the decisionsignals DS11, DS12, DS13, DS14, DS21, DS22, DS23, DS24, DS31, DS32,DS33, DS34, DS41, DS42, DS43, DS44 to provide the final decision signalFDS4 or sequentially outputs the decision signals DS14, DS24, DS34, DS44one by one as the final decision signal FDS4. The decision signals DS14,DS24, DS34, DS44 may be associated with one of the test parameters (forexample, the clock signal CK). The signal control block 810 connects thetest signal TS4 to the signal processing block 820 or connects the finaldecision signal FDS4 to the comparison circuit 444 in FIG. 9, inresponse to the second switching control signal SCS2. When the secondswitching control signal SCS2 is at a first logic level (for example,logic high level), the test signal TS4 is provided to the signalprocessing block 820. When the second switching control signal SCS2 isat a second logic level (for example, logic low level), the finaldecision signal FDS4 is provided to the comparison circuit 444 in FIG.9.

FIG. 11 is a block diagram illustrating an exemplary embodiment of thesignal processing block in BOT unit 520 in FIG. 10.

Referring to FIG. 11, the signal processing block 520 includes aplurality of signal processing units 550, 560, 570, 580. In FIG. 11, thesignal processing unit 550 is illustrated in detail, and each of thesignal processing units 560, 570, 580 may have substantially the samestructure as the signal processing unit 550.

The signal processing unit 550 includes a buffer 551, a relay 552, acomparison circuit 553 and a register 554. The buffer 551 buffers (orduplicates) the test signal TS1 to output the duplicated test signalDTS1. The buffer 551 is provided with first and second power supplyvoltages VIH, VIL, and a level of the first power supply voltage VIH ishigher than a level of the second power supply voltage VIL. Levels ofthe first and second power supply voltages VIH, VIL may be adjustedexternally, and thus the duplicated test signal DTS1 may be adjusted tohave a voltage level ranging between the first and second power supplyvoltages VIH, VIL. When voltage level of the test signal TS1 does nothave sufficient level margin, the duplicated test signal DTS1 may beadjusted to have sufficient level margin by adjusting levels of thefirst and second power supply voltages VIH, VIL. The relay 552 providesthe duplicated test signal DTS1 to the DUT 31 when a third controlsignal SCS3 is at a first logic level (for example, logic high level).

The comparison circuit 553 compares the test result signal TRS11 withthe reference level to provide the decision signal DS11 indicating thecomparison result to the register 554 when the third switching controlsignal SCS3 is at a second logic level (for example, logic low level).The comparison circuit 553 is provided with third and fourth powersupply voltages VOH, VOL, and a level of the third power supply voltageVOH is higher than a level of the fourth power supply voltage VOL.Levels of the third and fourth power supply voltages VOH, VOL may beadjusted externally, and thus the decision signal DS11 may be adjustedto have a voltage level ranging between the third and fourth powersupply voltages VOH, VOL. When the voltage level of the decision signalDS11 does not have a sufficient level margin, the decision signal DS11may be adjusted to provide a sufficient level margin by adjusting levelsof the third and fourth power supply voltages VOH, VOL.

The register 554 stores the decision signal DS11, and the register 554outputs the stored decision signal DS11 to the output selection block530 in FIG. 10 in response to a register control signal RCS.

With reference to FIG. 11, architecture and operation of the signalprocessing unit 550 are described, and architectures and operations ofother signal processing units 560, 570, 580 are substantially the sameas the architecture and the operation of the signal processing unit 550.Therefore, detailed description of the architectures and the operationsof other signal processing units 560, 570, 580 will be omitted. Thesignal processing unit 560 receives the test result signal TRS12 toprovide the decision signal DS12 to the output selection block 530. Thetest result signal TRS12 indicates the test result in the DUT 461 inresponse to the duplicated test signal DTS2. The signal processing unit570 receives the test result signal TRS13 to provide the decision signalDS13 to the output selection block 530. The test result signal TRS13indicates the test result in the DUT 461 in response to the duplicatedtest signal DTS3. The signal processing unit 580 receives the testresult signal TRS14 to provide the decision signal DS14 to the outputselection block 530. The test result signal TRS14 indicates the testresult in the DUT 461 in response to the duplicated test signal DTS4.

The signal processing unit 520 duplicates the test signal TS1 associatedwith one test parameter (for example, the data DQ), and provides theduplicated test signal DTS1 to each of the DUTs 461, 462, 463, 464. Inaddition, the signal processing unit 520 receives the test resultsignals TRS11˜TRS14, each associated with each of the test parameters,from the one DUT 461 to provide the decision signals DS11˜DS14, eachassociated with each of the test parameters based upon the test resultsignals TRS11˜TRS14. Each of the output selection blocks 530, 630, 730,830 merges the decision signals, each provided from different DUTs 461,462, 463, 464 and each associated with the same test parameter, orsequentially outputs the decision signals one by one, each provided fromdifferent DUTs 461, 462, 463, 464 and each associated with the same testparameter as the final decision signal.

The BOT module 450 may operate as an interface between the test device400 and the test board 460. The BOT module 450 may be mounted on thetest device 400, or the BOT module 450 may be mounted on the test board460.

The BOT device according to the exemplary embodiments may reduce testtime when a number of DUTs increases by duplicating limited test signalsto provide the duplicated test signals to DUTs, simultaneouslydetermining the test result signals from the DUTs and providing thefinal decision signal to the test device after the test is completed. Inaddition, the BOT device may operate as an interface between the testdevice and the test board, and thus, the conventional test device whichis very expensive may be employed without being modified. Therefore,test performance may be enhanced and a number of DUTs which are capableof simultaneously being tested may be increased without increasing testcost. Accordingly, the BOT device according to exemplary embodiments maybe widely employed in memory test situations.

The foregoing is illustrative of exemplary embodiments and is not to beconstrued as limiting thereof. Although a few exemplary embodiments havebeen described, those skilled in the art will readily appreciate thatmany modifications are possible in the exemplary embodiments withoutmaterially departing from the novel teachings and advantages of thepresent inventive concept. Accordingly, the exemplary embodiments,modifications to the disclosed exemplary embodiments, as well as otherexemplary embodiments, are intended to be included within the scope ofthe appended

What is claimed is:
 1. A test system, comprising: a test deviceconfigured to generate a plurality of test signals that correspond toeach of a plurality of test parameters; a built-off test moduleconfigured to duplicate the test signals, to apply a plurality ofduplicated test signals to each of a plurality of devices under testthrough each of corresponding channels, and to provide a plurality ofdecision signals based upon a plurality of final test result signalsreceived from each of the devices under test; and a test board connectedto the built-off test module through the channels, the devices undertest being mounted on the test board.
 2. The test system of claim 1,wherein the test device includes a plurality of signal generatingcircuits configured to generate the test signals and to receive thefinal test result signals, each of the signal generating circuitscomprising: a test pattern generator configured to generator a testpattern; a buffer which buffers the test pattern to output the testsignal; a first relay that provides the test signal to the built-offtest module when a first switching control signal is at a first logiclevel; and a comparison circuit that compares the corresponding finaltest result signal with a reference level to provide a final resultsignal when the first switching control signal is at a second logiclevel.
 3. The test system of claim 1, wherein the built-off test moduleincludes a plurality of built-off test units, each of the built-off testunits including: a signal processing block configured to duplicatecorresponding ones of the test signals, to apply a plurality ofduplicated test signals to each of devices under test, and to provide aplurality of decision signals based upon a plurality of test resultsignals from the corresponding device under test; an output selectionblock configured to merge or to sequentially output correspondingdecision signals as a corresponding final decision signal, in responseto an output mode selection signal; and a signal control blockconfigured to provide the corresponding test signal to the signalprocessing block or to provide the final decision signal to the testdevice, in response to a second switching control signal.
 4. The testsystem of claim 3, wherein the plurality of test signals aresimultaneously determined as pass or fail.
 5. The test system of claim1, wherein the built-off test module is mounted on the test board. 6.The test system of claim 1, wherein the built-off test module is mountedon the test device.